Full Flip Chip on Board (COB) LED Display
Self-develop COB packaging technology
Full flip chip on board
Self-built production line for scale production
Breaking through limitation of traditional packaging, VT Series has achieved ultra-finer pixel pitch below 1.0mm to produce crystal-clear images free of moire effect and over 10000:1 high contrast ratio for precise vibrant colors.
Advanced full flip-chip packaging ensures softer luminance and brings 170+° wide views with immaculate image quality in high uniformity from any angle.
Low-LED-failure-rate modules feature outstanding anti-collision capacity and waterproof resined surface; One-piece molded back shell conspires to provide high protection all around.
Cabinet-and-module-level wireless connection grants high transmission stability and hassle-free installation; Redundancy of power supply, receiving card, power & network cables further minimize downtime and guarantee long-lasting stable broadcasting.
Attach-to-shell power supply and optimal circuit board layout bring excellent heat dissipation, lower surface temperature, and more stable operation, improving the user experience significantly.
Adopted common cathode technology and high-efficiency light-emitting chips reduce power consumption by 40%; Dynamic energy efficiency and smart standby mode further improve energy efficiency.
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